Tuesday July 27, 2021
9:00AM - 10:00AM ESTWORKING GROUP #1
MATERIAL CHALLENGES ASSOCIATED WITH NEW WIDE BAND GAP SEMICONDUCTORS FOR COMPONENT PACKAGING
Materials, Components, and Reliability addresses the key challenges that wide band gap power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring.
- Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance
- Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates
- Sustainable materials
Moderator: Justin Kolbe, Global Market Strategy Head, Power Conversion & Industial Automation, Henkel
Technical Experts:
Rita Mohanty, Director, Technical Service Engineering-Thermal at Henkel Electronic Materials LLC
Yuan (David) Zhao, Senior Principal Engineer, HenkelAttendance for this Working Group is by Invitation-Only. To be considered as a participant, please email alishba.jan@iqpc.co.uk. Places are limited.
Wednesday July 28, 2021
8:00AM – 8:05AMOPENING REMARKS
Alishba Jan, Divisional Director, IQPC
EOPEI
8:05am - 8:50AM EST
URBAN AIR MOBILITY SUSTAINABLE APPROACHES FOR DEVELOPING THE NEXT-GENERATION OF HYBRID AND ALL-ELECTRIC AIRCRAFT
Neil Cloughley, CEO & Founder, Faradair
8:50AM – 9:50AM EST
ROBUST EARLY DETECTION OF BATTERY THERMAL RUNAWAY
Robust Early Detection of Battery Thermal Runaway (REDTR) is comprised of a suite of sensor elements within a surface mounted electronics module that can detect initial venting of lithium ion battery cells within 3 to 5 seconds within the battery enclosure independent of the battery electrochemistry, cell size, and pack venting strategy. The sensor suite only needs to be within the battery pack vapor space for proper detection, and while consuming minimal power, can act as an alarm system for the BMS under all operating conditions. REDTR can observe multiple physical phenomenon from a failing cell to indicate first vent as well as observe and quantify whether the runaway is propagating through the pack, allowing OEM's the best opportunity to provide rapid countermeasures to protect the pack.
Brian Engle, Business Development Manager, Amphenol Advanced Sensors
9:50AM – 10:30AM EST
DYNAMIC CONSIDERATIONS IN ELECTRIC DRIVETRAINS
Ryan O'Connor, Stress & Dynamics Analyst, Ingenium Technologies
Kate Walgren, Stress & Dynamics Analyst, Ingenium Technologies
10:30AM – 11:20AM EST
OVERCOMING THE CHALLENGES TOWARDS SUSTAINABLE ELECTRIFICATION – A MATERIAL SUPPLIERS PERSPECTIVE
> Increased power demand and need for reliability and efficiency of components
> Sustainable supply chain – cover Henkel’s corporate sustainability, renewable energies powering our production plants, REACh & CuD
> Innovations: approach to Corporate Venture Capital and recent investments and technology
Ruari O'Kane, Head Global Strategy Aviation, Space & Rail, Henkel
11:20AM – 12:00PM EST
NEW BATTERY TECHNOLOGIES & FUEL CELLS
Venkat Vishawanathan, Associate Professor, Carnegie Mellon University
12:00PM – 12:45PM EST
INNOVATIVE APPROACHES FOR ELECTRIC PROPULSION FUTURE DESIGN
Arif Salam, Staff Systems Engineer, Honeywell
12:45PM – 1:45PM EST
PERSPECTIVES FROM DEMONSTRATORS, UPSTARTS & DISRUPTORS THAT ARE TRYING TO DISRUPT THE CURRENT PARADIGM
THE LATEST AND GREATEST OPPORTUNITIES FOR AVIATION & AIRCRAFT
Kaydon Stanzione, Co-Founder & Member of the Board, Jaunt Air Mobility LLC
Josef Mouris, CEO & Co-Founder, Electron Aviation
Frederic Malleret, President, AeroWest Development
Thursday July 29, 2021
8:00AM - 9:00AM
WORKING GROUP #2
PRINTED ELECTRONICS FOR ELECTRIC AIRCRAFTS
Today's production and installation of electrical aircraft harnesses and sensors is very labor intensive, especially for highly customized cabins. Therefore, the ability to print electronic wiring and components (i.e., heating elements, sensors, wirings) offers a high potential to reduce production cost and even increase the degree of customization in future aircraft.
- What are the key sustainable materials the industry is focusing on?
- Why printed inks/printed electronics vs. conventional techniques?
- What is our value proposition?
- Understanding material certification
- Learnings for automotive – cross-over
Moderators:
Franck Bouttin, Global Key Account Manager Aerospace, Henkel
Stijn Gillissen, Global Head Printed Electronics, Henkel
Technical Experts:
Sharona Sente, Techical Service Engineer, Henkel
Stijn Gillissen, Global Head Printed Electronics, HenkelAttendance for this Working Group is by Invitation-Only. To be considered as a participant, please email alishba.jan@iqpc.co.uk. Places are limited.
9:00AM – 9:05AM
OPENING REMARKS
Alishba Jan, Divisional Director, IQPC9:05AM – 9:50AMGREEN HYDROGEN AIRCRAFT TECHNOLOGY - UNIVERSAL HYDROGEN KEYNOTE PRESENTATION
Jason Chua, Co-Founder, Chief Strategy & Product Officer, Universal Hydrogen
9:50AM – 10:40AM
MARKET OPPORTUNITIES & DESIGN CHALLENGES OF A SMALL ELECTRIC AIRCRAFT
Rolf Stuber, CEO & Head of Design, Smartflyer
10:40AM – 11:30AM
HEALTH MANAGEMENT FOR PASSENGER ELECTRIC AIRCRAFT
UNDERSTAND HOW TO DO A FUTURE ESTIMATION OF HOW OR WHEN COMPONENTS MIGHT FAIL
Chetan Kulkarni, Research Scientist, KBR Inc, NASA Ames Research Center
11:30AM – 12:30PM
STRATEGIES FOR MANAGING HIGH VOLTAGE ISSUES
David Amet, Business Development Manager, Amphenol Military & Aerospace
12:30PM – 1:30PM
SOLUTIONS FOR ENSURING VERY HIGH SAFETY FOR HYBRID, HYBRID-ELECTRIC & ALL-ELECTRIC AIRCRAFT
Tine Tomazic, Group CTO, Pipistrel