Ahead of the 4th Annual Advanced Power Electronics and EV/HEV 2023 event, Automotive IQ spoke to Pradip Chatterjee, Senior Principle Engineer at Nexperia, on the advancements in wide-bandgap (WBG) semiconductors.
Here are the key topics covered in the interview:
Power electronics play a pivotal and indispensable role in the advancement of electric and hybrid vehicles. The goal of efficiency, extended range, attainment of zero emissions objectives, and commitment to sustainability are the driving factors influencing the selection and integration of power electronics components. A considerable number of semiconductor enterprises are actively channelling investments into the development of new fabrication facilities and cutting-edge technologies such as silicon carbide (SiC) and gallium nitride (GaN). However, amidst this global realignment, the paramount objective remains centred on optimising efficiency.
As OEMs forge ahead with strategic initiatives to enhance their offerings with heightened range and efficiency, the demand for power devices and modules that are more dependable, efficient, and ecologically sound continues to experience an upward trajectory.
As the 4th Advanced Power Electronics for EV/HEV 2023 conference returns to Munich this October, Automotive IQ conducted extensive research with multiple industry experts, from key OEMs and Tier-1 companies. This research made it clear what the hottest topics, trends and causes for concern are in the industry. This article has been curated to showcase those top trends within the power electronics space, with insights taken directly from those key industry leaders.
In this interview between Automotive IQ and Simon Hart, Honorary Associate Professor in Power Conversion for Electrical Transportation at the University of Nottingham, Simon delves into crucial aspects of thermal management in traction power system design. He emphasises the significance of optimising not only for lowest temperatures but also for reducing losses and utilising ideal temperatures.
Simon discusses the feasibility of a single coolant selection for the vehicle powertrain, advocating for a strategic approach that balances inventory reduction with the necessity for separate cooling loops tailored to specific components. He also comments on the balance between integration and flexible design, stressing the importance of both component serviceability and system-wide integration. Furthermore, Simon sheds light on the relationship between software and hardware, highlighting how their co-design can lead to more efficient solutions, as well as exploring methods to mitigate thermal resistance and losses while supporting scalability.
As OEMs adopt powerful strategies to move forward and find products that offer high range and efficiency, the need for more reliable, efficient, and sustainable power devices and modules is continuing to grow.
This year, Automotive IQ’s Advanced Power Electronics for EV/HEV 2023 conference gives the industry an event that is focused on the biggest challenges and opportunities in the power electronics space for EVs and HEVs, with an agenda focusing on solutions that people working in Power Electronics, EMC Houses, Testing and Certification, R&D, eMobility, Semiconductors, Hardware, Embedded Software, and Functional Safety are looking for.
This year, Automotive IQ’s Advanced Power Electronics of EV/HEV 2023 conference gives the industry an event that is focused on the big ...